Home/Applications/Hot Melt Adhesive Compounding Application · Specialty & Low-Temperature Hot Melt Adhesive Compounding: Low Shear, Underwater Cutting Hot melt is 120–160 °C, low shear and vacuum-degassed: high shear or 170 °C+ oxidizes the resin and turns the adhesive brown, and trapped bubbles break the glue line. A reference hot melt adhesive compounding page from Kerke. […]